General PCB Design MCQs

1. Which of the following is not a film used in PCB design?

2. Which one of the following is not a plating technique?

3. The analog and the digital circuit on the same PCB should have _____.

4. When two transmission lines are placed close to each other, they are said to be coupled. This coupling can be used to built

5. Etch back is a technique by which ______.

6. Parasitic effects influence the working of a PCB.

7. In the layout approach, a 'Puppet' is used for_____.

8. For TTL , we require a wave impedance of_____.

9. Large values of wave impedance call for _____.

10. Screen printing is used in _____.

11. Which of the following is not a machine cleaning process for boards?

12. Which of the following is a design constraint for the design of the flexible PCBs?

13. Self soldering or soldering generally implies that the joining process occurs at temperatures below

14. What is hot air leveling used for?

15. A conductor in a printed circuit should be considered a transmission line if its length l (in meters) is

16. Which of the following is not a physical characteristic of a copper clad laminate?

17. In fast signal or high – speed logic circuits , the conductors are considered to be _____.

18. Copper plating is done in multilayer boards to _____.

19. The dielectric constant of any material is also referred to as _____.

20. Which of the following techniques is used in mass soldering?

21. Which of the following is a technique for the generation of the circuit pattern on metal core boards?

22. By which material is the typical resin/filler laminate of ordinary PCBs replaced in metal core boards?

23. Which of the following is not a solder alloy?

24. Which of the following is a category of dry film resists?

25. For the etching process, the temperature should preferably be around

26. The volume resistivity of a laminate is given by

27. A standard hole(0.8mm) in a PCB design is represented by which symbol.

28. The biggest problem associated with striplines and microstrip lines is the

29. Ferric chloride is used in PCB designing as a/an _____.

30. In which of the following ways can the required quantity of heat for the melting of the solder be supplied?

31. Which of the following is a base material used in the manufacturing of flexible PCBs?

32. Which of the following is not a basic ingredient of a copper clad laminate?

33. Ultra thin copper foil has a range of thickness varying from

34. Current spikes in TTL circuit boards can be eliminated by which technique.

35. Which of the following tests is done for quality control for multilayer boards?

36. The skin-effect losses are sometimes also called

37. By which material is the transfer of the conductor pattern from the film master on to the copper clad base material done?

38. Removing the resists from the board in photo printing is called

39. Which size of rack is used as a standard rack in PCB design?

40. The microstrip line is derived from a _____.

41. Crosstalk is much less dangerous in which of the following.

42. hich of the following can be called multilayer construction?

43. On a PCB, the low power part and the high power part have to be spread sufficiently to avoid _____.

44. To overcome the motorboating effect, we must _____.

45. If a ground line is kept close to a signal line, crosstalk would be _____.

46. Which of the following is a type of soldering fluxes?

47. Under which of the following conditions is a multilayers board used?

48. Fabrication of PCBs for microwave use requires

49. The biggest disadvantage of flexible PCBs is that

50. How much copper surface is reserved on multilayer boards for the solderability test?

51. The fundamental principle of electrolysis is understood from

52. If Ohmic losses are neglected, the wave impedance Zw in a homogenous material can be calculated by using the formula.

53. What would be the simplest and most suitable remedy for electro-magnetic coupling between two wires?

54. It is a common experience of electronic circuit designers that at high frequency{>10 MHz), amplifiers behave as _____.

55. Under etching can be minimized by keeping the etching time _____.

56. Which of the following is a solderability test method?

57. Which of the following is a coating process for wet film resists?

58. Which of the following is a disadvantage of a solder mask?

59. In which of the following processes is porosity test done?

60. Which of the following is a characteristic parameter of a photographic material?

61. The inks used in screen printing are mostly

62. Which of the following is a mechanical machining operation on PCBs?

63. Multiwire boards are used in

64. All the processing steps for manufacturing ultra thin foils except ____are conventional.

65. The absolute dimensional accuracy of a film master is determined by

66. In the component code used in the circuit diagram, by which letter, according to ANSI, is an integrated circuit represented?

67. To reduce the skin-effect losses, what is required to be done.

68. Polymeric materials exhibit a very high resistance to