PCB Design Quiz # 1

Which of the following is not a film used in PCB design?

A copper film

A polyester film

A photographic glass

A tri-acetate film

Which one of the following is not a plating technique?

Immersion plating

Electroless plating

Hard plating

Electroplating

The analog and the digital circuit on the same PCB should have _____.

common ground conductor networks

independent ground conductor networks

no ground conductor network

None of the above

When two transmission lines are placed close to each other, they are said to be coupled. This coupling can be used to built

band pass filters

band elimination filters

directional couplers

All of the above

Etch back is a technique by which ______.

epoxy smear is removed and the exposed glass fibers prepared for copper deposition

epoxy smear is deposited and the exposed glass fibers prepared for copper removal

etchants are removed again

None of the above

Parasitic effects influence the working of a PCB.

true

false

sometimes true and sometimes false

In the layout approach, a 'Puppet' is used for_____.

a diode

a transistor

an IC

any commonly used electronic component

For TTL , we require a wave impedance of_____.

50-100ohm

100-150ohm

150-200ohm

200-250ohm

Large values of wave impedance call for _____.

broader signal conductors

thin signal conductors

both a and b

Screen printing is used in _____.

photo printing

screen printing

hand printing

All of the above

Which of the following is not a machine cleaning process for boards?

Sanding

Water rinse

Wet brushing

Scrubbing

Which of the following is a design constraint for the design of the flexible PCBs?

Current carrying capacity of the conductors

Bending

Contours

All of the above

Self soldering or soldering generally implies that the joining process occurs at temperatures below

100°c

200°c

350°c

450°c

What is hot air leveling used for?

Etching

PCB finishing

PCB layout

PCB artwork

A conductor in a printed circuit should be considered a transmission line if its length l (in meters) is

l > Tr/100 nsec ( Tr- rise time of pulse)

l > 2Tr/100 nsec

l > Tr/200 nsec

l > 2Tr/50 nsec

Which of the following is not a physical characteristic of a copper clad laminate?

Flame resistance

Water absorption

Flexural strength

Color

In fast signal or high – speed logic circuits , the conductors are considered to be _____.

impedances

transmission lines

capacitors

inductors

Copper plating is done in multilayer boards to _____.

remove etchants

remove excess copper

withstand thermal shock due to soldering

clean a PCB with chemicals

The dielectric constant of any material is also referred to as _____.

permeability

permittivity

proximity

resistivity

Which of the following techniques is used in mass soldering?

Dip soldering

Drag soldering

Wave soldering

All of the above

Which of the following is a technique for the generation of the circuit pattern on metal core boards?

Substance additive processing

Additive processing with catalytic adhesive

Semi-additive processing

Both a and b

By which material is the typical resin/filler laminate of ordinary PCBs replaced in metal core boards?

Sheet metal covered with insulation material

Cardboard

Foil with insulation

None of the above

Which of the following is not a solder alloy?

Tin lead

Tin antimony

Tin silver

Iron lead

Which of the following is a category of dry film resists?

Solvent developing dry film resists

Liquid developing dry film resists

Hand developing dry film resists

All of the above

For the etching process, the temperature should preferably be around

30°C

10°C

45°C

100°C

The volume resistivity of a laminate is given by

R*A / l R- resistance measured

R*l / A A-area of gourde electrode (cm2)

A*l / R l-thickness of sample(cm)

R / A*l

A standard hole(0.8mm) in a PCB design is represented by which symbol.

О

€

Ө

β

The biggest problem associated with striplines and microstrip lines is the

low attenuation per unit length

high attenuation per unit length

low impedance per unit length

high impedance per unit length

Ferric chloride is used in PCB designing as a/an _____.

resist

etchant

board cleaner

a soldering material

In which of the following ways can the required quantity of heat for the melting of the solder be supplied?

Iron soldering

Hot gas soldering

Radiant heat soldering

All of the above